Kontron COMe-mSP1 Manuale Utente

Navigare online o scaricare Manuale Utente per Hardware Kontron COMe-mSP1. Kontron COMe-mSP1 User Manual Manuale Utente

  • Scaricare
  • Aggiungi ai miei manuali
  • Stampa
  • Pagina
    / 97
  • Indice
  • SEGNALIBRI
  • Valutato. / 5. Basato su recensioni clienti

Sommario

Pagina 1 - COMe-mSP1

COMe-mSP1Document Revision 160www.kontron.com

Pagina 2

COMe-mSP1 / Introduction2.4 COM Express® DocumentationThis product manual serves as one of three principal references for a COM Express® design. It do

Pagina 3 - » Table of Contents «

COMe-mSP1 / Product Specification3 Product Specification3.1 Modules & AccessoriesThe COM Express® mini sized Computer-on-Module COMe-mSP1 (NOW1) f

Pagina 4

COMe-mSP1 / Product SpecificationAccessories Product Number Carrier Boards 34101-0000-00-1 COM Express® Eval Carrier Type 10 34100-0000-00-0 COM Ex

Pagina 5

COMe-mSP1 / Product Specification3.2 Functional SpecificationProcessorThe Intel® ATOM™ (Silverthorne) CPU family supports:» Intel® Hyper-Threading Tec

Pagina 6 - 1 User Information

COMe-mSP1 / Product SpecificationGraphics CoreThe integrated Intel® GMA 500 based on PowerVR SGX535 core supports: Graphics Core Render Clock 200MHz,

Pagina 7 - 1.6 Technical Support

COMe-mSP1 / Product SpecificationConnectivityUSB 8x USB 2.0 USB Client 1x USB Client (USB #7) PCI - PCI External Masters - PCI Express 1x PCIe x1 Gen1

Pagina 8 - 2 Introduction

COMe-mSP1 / Product SpecificationPower Consumption and PerformanceFull Load Power Consumption 4.9 - 6.2W Kontron Performance Index 1108 - 1687 Kontron

Pagina 9 - COMe-mSP1 / Introduction

COMe-mSP1 / Product Specification3.3 Block Diagram 17

Pagina 10 - 2.5 COM Express® Benefits

COMe-mSP1 / Product Specification3.4 Electrical Specification3.4.1 Supply VoltageFollowing supply voltage is specified at the COM Express® connector:V

Pagina 11 - 3 Product Specification

COMe-mSP1 / Product Specification3.4.5 ATX ModeBy connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press t

Pagina 13 - 3.2 Functional Specification

COMe-mSP1 / Product Specification3.5 Power ControlPower SupplyThe COMe-mSP1 supports a power input from 4.75 - 14V. The supply voltage is applied thro

Pagina 14 - Graphics Core

COMe-mSP1 / Product Specification3.6 Environmental Specification3.6.1 Temperature SpecificationGeneral Specification Operating Non-operating Commerc

Pagina 15 - Kontron Features

COMe-mSP1 / Product Specification3.7 Standards and CertificationsRoHSThe COMe-mSP1 is compliant to the directive 2002/95/EC on the restriction of the

Pagina 16 - Supported Operating Systems

COMe-mSP1 / Product SpecificationShock & VibrationThe COM Express® mini form factor Computer-on-Modules successfully passed shock and vibration te

Pagina 17 - 3.3 Block Diagram

COMe-mSP1 / Product Specification3.8 MTBFThe following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s te

Pagina 18 - 3.4 Electrical Specification

COMe-mSP1 / Product Specification3.9 Mechanical Specification3.9.1 Module Dimension» 55mm x 84mm (±0.2mm)3.9.2 Height on Top» Maximum approx. 3.5mm (w

Pagina 19 - 3.4.6 Single Supply Mode

COMe-mSP1 / Product Specification3.10 Thermal ManagementA heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-mSP1. The hea

Pagina 20 - 3.5 Power Control

COMe-mSP1 / Features and Interfaces4 Features and Interfaces4.1 Onboard SSDThe COMe-mSP1 features an onboard Greenliant PATA NAND flash drive with cap

Pagina 21 - 3.6.2 Humidity

COMe-mSP1 / Features and Interfaces4.2 LPCThe Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset.

Pagina 22 - Conformal Coating

COMe-mSP1 / Features and Interfaces4.3 LPC bootThe COMe-mSP1 supports boot from an external Firmwarehub on LPC bus (LPC FWH). The external LPC FWH can

Pagina 23 - Shock & Vibration

» Table of Contents «1 User Information...61.1 About This Document...

Pagina 24 - 3.8 MTBF

COMe-mSP1 / Features and Interfaces4.4 M.A.R.S.The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Recharge

Pagina 25 - 3.9 Mechanical Specification

COMe-mSP1 / Features and Interfaces4.5 Fast I2C & SMBusThe COMe-mSP1 integrates two configurable I2C buses. The external I2C provided via US15W GP

Pagina 26 - 3.11 Heatspreader

COMe-mSP1 / Features and Interfaces4.6 JIDA16 and JIDA32JIDA16 (JUMPtec® Intelligent Device Architecture) is a BIOS interface which allows programs ru

Pagina 27 - 4 Features and Interfaces

COMe-mSP1 / Features and Interfaces4.7 K-Station 1Based on the JIDA32 interface users can implement advanced board functionality in their application.

Pagina 28

COMe-mSP1 / Features and Interfaces4.8 K-Station & API Resources4.8.1 I2CBUS Function I2C 0 External / JIDA I2C I2C 1 SM-Bus I2C 2 SDVO DDC I2

Pagina 29 - 4.3 LPC boot

COMe-mSP1 / Features and Interfaces4.9 GPIO - General Purpose Input and OutputThe offers 4 General Purpose Input (GPI) pins and 4 General Purpose Outp

Pagina 30 - 4.4 M.A.R.S

COMe-mSP1 / Features and Interfaces4.10 Watchdog TimerYou can configure the Watchdog Timer (WDT) in BIOS setup to start after a set amount of time aft

Pagina 31 - 4.5 Fast I2C & SMBus

COMe-mSP1 / Features and Interfaces4.11 Flash Backup FeatureThe COMe-mSP1 supports a new functionality called “Flash Backup”. This new feature allows

Pagina 32 - 4.6 JIDA16 and JIDA32

COMe-mSP1 / Features and InterfacesFlash your BIOS with custom defaults:To flash a BIOS with customized defaults extracted like described above, use f

Pagina 33 - 4.7 K-Station 1

COMe-mSP1 / Features and Interfaces4.12 Speedstep TechnologyThe Intel® processors offers the Intel® Enhanced SpeedStep™ technology that automatically

Pagina 34 - 4.8.4 Hardware Monitor

COMe-mSP1 / 4.3 LPC boot...

Pagina 35 - Configuration

COMe-mSP1 / Features and Interfaces4.13 C-StatesNew generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O

Pagina 36 - 4.10 Watchdog Timer

COMe-mSP1 / Features and Interfaces4.14 Hyper ThreadingHyper Threading (officially termed Hyper Threading Technology or HTT) is an Intel®-proprietary

Pagina 37 - 4.11 Flash Backup Feature

COMe-mSP1 / Features and Interfaces4.15 ACPI Suspend Modes and Resume EventsThe COMe-mSP1 supports the S3 state (=Save to Ram). S4 (=Save to Disk) is

Pagina 38

COMe-mSP1 / Features and Interfaces4.16 USBThe USB interface comes with three USB controllers (6 USB ports). The USB configuration of the COMe-mSP1 mo

Pagina 39 - 4.12 Speedstep Technology

COMe-mSP1 / Features and Interfaces4.17 SDIOThe SD card standard is a standard for removable memory storages designed and licensed by the SD Card Asso

Pagina 40 - 4.13 C-States

COMe-mSP1 / Features and Interfaces4.18 Graphics InterfaceThe COMe-mSP1 uses the graphics accelerator GMA500 with 200MHz GPU clock integrated in the I

Pagina 41 - 4.14 Hyper Threading

COMe-mSP1 / Features and InterfacesVGAThe nanoETXexpress-SP graphics subsystem GMA500 integrated in the Intel® System Controller Hub US15W does not su

Pagina 42

COMe-mSP1 / Features and Interfaces4.19 LPC BusThe Low Pin Count Interface signals are connected to the LPC Bus bridge, which is located in the Intel®

Pagina 43 - 4.16 USB

COMe-mSP1 / Features and InterfacesZero Delay Clock BufferDo not use the reference schematic in the COM Express Design Guide. Either use another Clock

Pagina 44 - 4.17 SDIO

COMe-mSP1 / System Resources5 System Resources5.1 Interrupt Request (IRQ) LinesPlease be aware that an ACPI OS decides itself on resource usage. The t

Pagina 45 - 4.18 Graphics Interface

COMe-mSP1 / 6.4.3 Advanced Menu...

Pagina 46

COMe-mSP1 / System Resources5.1.2 In APIC modeIRQ# Used For Available Comment 0 Timer 0 No - 1 Keyboard No - 2 Slave 8259 No - 3 External

Pagina 47 - 4.19 LPC Bus

COMe-mSP1 / System Resources5.2 Memory AreaThe first 640 kB of DRAM are used as main memory. Using DOS, you can address 1 MB of memory directly. Memor

Pagina 48 - Zero Delay Clock Buffer

COMe-mSP1 / System Resources5.4 Peripheral Component Interconnect (PCI) DevicesAll devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3)

Pagina 49 - 5 System Resources

COMe-mSP1 / System Resources5.9 Pinout List5.9.1 General Signal DescriptionType Description I/O-3,3 Bi-directional 3,3 V IO-Signal I/O-5T Bi-dir. 3,3

Pagina 50 - 5.1.2 In APIC mode

COMe-mSP1 / System Resources5.9.2 Connector X1A Row APin Signal Description Type Termination (CE 4.x.x) Comment A1 GND_1 Power Ground PWR -

Pagina 51 - 5.3 I/O Address Map

COMe-mSP1 / System Resources3.3V A64 PCIE_TX1+ PCIe lane #1 Transmit+ DP-O PU 50R inUS15W only available on no-LAN var. A65 PCIE_TX1- PCIe lane

Pagina 52 - 5.7 SDVO I2C Bus

COMe-mSP1 / System Resources5.9.3 Connector X1A Row BPin Signal Description Type Termination (CE 4.x.x) Comment B1 GND_16 Power Ground PWR -

Pagina 53 - 5.9 Pinout List

COMe-mSP1 / System ResourcesB63 SDIO_CD# / GPO3 SDIO#0 CardDetect / General Purpose Output 3 I-3.3 / O-3.3 PU 10k 3.3V / PD 100k - / - B64 PCIE_

Pagina 54 - 5.9.2 Connector X1A Row A

COMe-mSP1 / System Resources5.9.4 SDVO Connector J1801 (optional)With hardware revision CE 4.x.x or newer the COMe-mSP1 provides an optional Serial DV

Pagina 55 - COMe-mSP1 / System Resources

COMe-mSP1 / System Resources5.9.5 XDP Connector J1400 (optional)The COMe-mSP1 provides the XDP debug port of Silverthorne CPU optionally with connecto

Pagina 56 - 5.9.3 Connector X1A Row B

COMe-mSP1 / User Information1 User Information1.1 About This DocumentThis document provides information about products from Kontron Europe GmbH and/or

Pagina 57

COMe-mSP1 / BIOS Operation6 BIOS OperationThe module is equipped with AMI® CORE8 BIOS, which is located in an onboard SPI/LPC flash memory. You can up

Pagina 58

COMe-mSP1 / BIOS Operation6.3 Setup GuideThe AMIBIOS Setup Utility changes system behavior by modifying the BIOS configuration. The setup program uses

Pagina 59

COMe-mSP1 / BIOS OperationMenu BarThe menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection. Lege

Pagina 60 - 6 BIOS Operation

COMe-mSP1 / BIOS Operation6.4 BIOS Setup6.4.1 Main MenuFeature Option Description System Time [hh:mm:ss] <Tab>, <Shift-Tab>, or <En

Pagina 61 - 6.3 Setup Guide

COMe-mSP1 / BIOS Operation6.4.2 Module InfoModule Component Steppings64

Pagina 62

COMe-mSP1 / BIOS OperationModule Software RevisionsMemory Module Information65

Pagina 63 - 6.4 BIOS Setup

COMe-mSP1 / BIOS OperationSlot 1Current Memory Configuration SLOT1 shows information of onboard system memory stored in SPD. The SPD EEPROM is support

Pagina 64 - 6.4.2 Module Info

COMe-mSP1 / BIOS Operation6.4.3 Advanced Menu67

Pagina 65 - Memory Module Information

COMe-mSP1 / BIOS OperationCPU ConfigurationFeature Option Description Max CPUID Value Limit Disabled Enabled Disabled for WindowsXP Intel® Virtualiz

Pagina 66 - Current LVDS Configuration

COMe-mSP1 / BIOS OperationIDE ConfigurationFeature Option Description IDE Controller Enabled Disabled Enables or disables the IDE interface of US15W

Pagina 67 - 6.4.3 Advanced Menu

COMe-mSP1 / User Information1.5 WarrantyThis Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty per

Pagina 68 - CPU Configuration

COMe-mSP1 / BIOS OperationIDE Device SubmenuFeature Option Description Type Not Installed Auto CD/DVD ARMD Selects the type of the IDE Devices conn

Pagina 69 - IDE Configuration

COMe-mSP1 / BIOS OperationSDIO ConfigurationFeature Option Description Select SDIO or GPIO SD Card GPIO The SD card interface is shared with module

Pagina 70 - IDE Device Submenu

COMe-mSP1 / BIOS OperationLPC I/O Controller ConfigurationFeature Option Description Serial Port1 Address Disabled 3F8/IRQ4 2F8/IRQ3 3E8/IRQ4 2E8/I

Pagina 71 - SDIO Configuration

COMe-mSP1 / BIOS OperationACPI ConfigurationFeature Option Description ACPI Version ACPI v.3.0 ACPI v.2.0 Selects the ACPI version ACPI APIC support

Pagina 72 - COMe-mSP1 / BIOS Operation

COMe-mSP1 / BIOS OperationACPI Cooling OptionsFeature Option Description Passive Trip Point Disabled 40°C 45°C 50°C … 110°C This value controls the

Pagina 73 - ACPI Configuration

COMe-mSP1 / BIOS OperationPassive CoolingThe ACPI OS assesses the optimum CPU performance change necessary to lower the temperature using the followin

Pagina 74 - ACPI Cooling Options

COMe-mSP1 / BIOS OperationMiscellaneous SettingsFeature Option Description Spread Spectrum Disabled LVDS Core Both Enables or Disables spread spectr

Pagina 75

COMe-mSP1 / BIOS OperationI2C BusesFeature Option Description JIDA I2C Bus Speed Very high High Medium Slow Very slow Ultra Slow Select speed for JI

Pagina 76 - Miscellaneous Settings

COMe-mSP1 / BIOS OperationWatchdogFeature Option Description Mode Reset Disabled Selects the mode of the watchdog Timeout 1s 5s 10s 30s 1:00m 5:00

Pagina 77 - I2C Buses

COMe-mSP1 / BIOS OperationMARS Interface ConfigurationFeature Option Description MARS Disabled Auto SMB Charger SMB Manager Enables the MARS functio

Pagina 78 - Watchdog

COMe-mSP1 / Introduction2 Introduction2.1 Product DescriptionThis credit card sized COM Express® mini module is compatible to COM Express® pin-out Typ

Pagina 79 - MARS Interface Configuration

COMe-mSP1 / BIOS OperationEthernet ConfigurationFeature Option Description Onboard Gigabit Ethernet Disabled Enabled Disables / Enables the onboard

Pagina 80 - Ethernet Configuration

COMe-mSP1 / BIOS OperationPCIExpress ConfigurationFeature Option Description PCIe Ports Both Disabled Port 0 Port 1 Disables or enables according PC

Pagina 81 - PCIExpress Configuration

COMe-mSP1 / BIOS OperationTrusted ComputingFeature Option Description TCG/TPM SUPPORT No Yes Enable/Disable TPM TCG (TPM 1.1/1.2) support in BIOS 82

Pagina 82 - Trusted Computing

COMe-mSP1 / BIOS OperationUSB ConfigurationFeature Option Description Legacy USB Support Disabled Enabled Enables / disables support for legacy USB

Pagina 83 - USB Configuration

COMe-mSP1 / BIOS OperationUSB Mass Storage Device ConfigurationFeature Option Description USB Mass Storage Reset Delay 10 Sec 20 Sec 30 Sec 40 Sec

Pagina 84

COMe-mSP1 / BIOS OperationHardware Health ConfigurationFeature Option Description Module HWM: H/W Health Function Disabled Enabled Enables the onboa

Pagina 85 - Hardware Health Configuration

COMe-mSP1 / BIOS Operation6.4.4 Advanced PCI/PnP SettingsFeature Option Description Clear NVRAM No Yes Clear NVRAM once during next system boot. PCI

Pagina 86

COMe-mSP1 / BIOS Operation6.4.5 Boot87

Pagina 87 - 6.4.5 Boot

COMe-mSP1 / BIOS OperationBoot Setting ConfigurationFeature Option Description Dark Boot Disabled Enabled Disabled: Shows normal POST messages Enabl

Pagina 88 - Boot Setting Configuration

COMe-mSP1 / BIOS OperationUSB Bootable Port ConfigurationFeature Option Description Port 0 - 7 Disabled Enabled Enables/Disables a specific port to

Pagina 89

COMe-mSP1 / Introduction2.3 Understanding COM Express® FunctionalityAll Kontron COM Express® basic and compact modules contain two 220pin connectors;

Pagina 90 - 6.4.6 Security

COMe-mSP1 / BIOS Operation6.4.6 SecurityFeature Option Description Change Supervisor Password Type in Change User Password Type in Boot Sector Virus

Pagina 91

COMe-mSP1 / BIOS Operation6.4.7 Advanced Chipset Settings91

Pagina 92

COMe-mSP1 / BIOS OperationGraphic Controller ConfigurationFeature Option Description Primary Graphic Adapter PCIe/Onboard Onboard Selects which grap

Pagina 93 - Display Control

COMe-mSP1 / BIOS OperationDisplay ControlFeature Option Description Boot Display Device Auto LVDS SDVO-CRT SDVO-DVI/HDMI Select the Boot Display Dev

Pagina 94 - Internal LVDS Configuration

COMe-mSP1 / BIOS OperationInternal LVDS ConfigurationFeature Option Description Flat Panel Mode Auto Fixed Mode PAID FPID Selects the Mode for the f

Pagina 95

COMe-mSP1 / BIOS OperationSystem Controller Hub ConfigurationFeature Option Description USB UHCI Controller Disabled 2 USB Ports 4 USB Ports … 8 U

Pagina 96 - 6.4.8 Exit Menu

COMe-mSP1 / BIOS Operation6.4.8 Exit MenuFeature Description Save To RTC/EEPROM and Exit Saving system setup to RTC and EEPROM and exit setup. F10 k

Pagina 97 - Corporate Offices

COMe-mSP1 / BIOS Operation.....Corporate Offices Europe, Middle East & AfricaOskar-von-Miller-Str. 185386 Eching/MunichGermanyTel.: +49 (

Commenti su questo manuale

Nessun commento