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COMe-mSP1 / Product Specification
3.6 Environmental Specification
3.6.1 Temperature Specification
General Specification Operating Non-operating
Commercial grade 0°C to +60°C -30°C to +85°C
Extended (E1) -25°C to +75°C -30°C to +85°C
Industrial grade (E2) -40°C to +85°C -40°C to +85°C
Standard modules are available for commercial grade temperature range. Please see
chapter Product Specification for available variants for extended or industrial temperate
grade
With Kontron heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
3.6.2 Humidity
» Operating: 10% to 90% (non condensing)
» Non operating: 5% to 95% (non condensing)
21
- COMe-mSP1 1
- » Table of Contents « 3
- 1 User Information 6
- 1.5 Warranty 7
- 1.6 Technical Support 7
- 2 Introduction 8
- COMe-mSP1 / Introduction 9
- 2.5 COM Express® Benefits 10
- 3 Product Specification 11
- Accessories 12
- 3.2 Functional Specification 13
- Graphics Core 14
- Power Features 15
- Connectivity 15
- Misc Interfaces and Features 15
- Kontron Features 15
- Supported Operating Systems 16
- 3.3 Block Diagram 17
- 3.4 Electrical Specification 18
- 3.4.5 ATX Mode 19
- 3.4.6 Single Supply Mode 19
- 3.5 Power Control 20
- 3.6.2 Humidity 21
- CE marking 22
- WEEE Directive 22
- Conformal Coating 22
- Shock & Vibration 23
- 3.8 MTBF 24
- 3.9 Mechanical Specification 25
- 3.10 Thermal Management 26
- 3.11 Heatspreader 26
- 4 Features and Interfaces 27
- 4.3 LPC boot 29
- 4.4 M.A.R.S 30
- 4.5 Fast I2C & SMBus 31
- 4.6 JIDA16 and JIDA32 32
- 4.7 K-Station 1 33
- 4.8.1 I2C 34
- 4.8.2 Storage 34
- 4.8.3 GPIO 34
- 4.8.4 Hardware Monitor 34
- Configuration 35
- 4.10 Watchdog Timer 36
- 4.11 Flash Backup Feature 37
- 4.12 Speedstep Technology 39
- 4.13 C-States 40
- 4.14 Hyper Threading 41
- 4.16 USB 43
- 4.17 SDIO 44
- 4.18 Graphics Interface 45
- 4.19 LPC Bus 47
- Zero Delay Clock Buffer 48
- 5 System Resources 49
- 5.1.2 In APIC mode 50
- 5.2 Memory Area 51
- 5.3 I/O Address Map 51
- 5.5 Internal I2C Bus 52
- 5.6 JILI I2C Bus 52
- 5.7 SDVO I2C Bus 52
- 5.9 Pinout List 53
- 5.9.2 Connector X1A Row A 54
- COMe-mSP1 / System Resources 55
- 5.9.3 Connector X1A Row B 56
- 6 BIOS Operation 60
- 6.3 Setup Guide 61
- 6.4 BIOS Setup 63
- 6.4.2 Module Info 64
- Module Software Revisions 65
- Memory Module Information 65
- Current LVDS Configuration 66
- 6.4.3 Advanced Menu 67
- CPU Configuration 68
- IDE Configuration 69
- IDE Device Submenu 70
- SDIO Configuration 71
- COMe-mSP1 / BIOS Operation 72
- ACPI Configuration 73
- ACPI Cooling Options 74
- Miscellaneous Settings 76
- I2C Buses 77
- Watchdog 78
- MARS Interface Configuration 79
- Ethernet Configuration 80
- PCIExpress Configuration 81
- Trusted Computing 82
- USB Configuration 83
- Hardware Health Configuration 85
- 6.4.5 Boot 87
- Boot Setting Configuration 88
- 6.4.6 Security 90
- Display Control 93
- Internal LVDS Configuration 94
- 6.4.8 Exit Menu 96
- Corporate Offices 97
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